Taiwan chip maker, Mediatek is eyeing the IoT market.
The company has announced two new-on-chips (SOC) systems, MediaTek filogic 130 and filogic 130A, which integrates microprocessors (MCU), AI Engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and power management units (PMU) into one chip .
Filogic 130A also has a digital audio signal processor to allow device makers to add voice assistants and other services to their products.
“This all-in-one solution provides energy-efficient connectivity, reliability, and high performance in the design of a small form factor that is ideal for various IOT devices,” said the company in a media statement.
Filogic 130 and Filogic 130A Supports 1T1R connectivity Wi-Fi 6 and dual-band 2.4GHz and 5GHz, along with advanced Wi-Fi features such as Target (TWT), Mu-Mimo, Mu-ofdma, service quality (QoS)) and WA-FI security WPA3.
To ensure that the user’s Wi-Fi connectivity is remain reliable even when Bluetooth devices are used at the same time, the solution supports advanced Wi-Fi and Bluetooth coexistence.
Two single chip solutions integrate the ARM Cortex-M33 microcontroller supported by embedded RAM and external flash and integrated front-end modules (iFem) that support the functionality of noise (LNA) amplifiers and power amplifiers (PA).
Filogic 130A also integrates integrated DSP HIFI4 for remote field sound processing, the ability of microphones is always on detection of voice activity and trigger word support.
Filogic 130 and Filogic 130A are designed to maximize power efficiency in the smallest and lowest power form factor, allowing devices to achieve ENERGY STAR and Green Appliance Rating and Certification.
The solution also supports the Crypto boot and hardware machines that are safe for strong security capabilities and various interfaces including general purpose iOS such as SPI, I2C, I2S, IR, UART, AuxADC, PWM and GPIO interface to make the design process easier.
“In the coming years, advanced connectivity technology such as Wi-Fi 6 and Bluetooth 5.2 will be what must be owned for smart home devices with the increasing need for other AI processing power, energy efficiency and strong security.
Filogic Solution 130 and Filogic 130A MediaTek Offering a perfect combination of features to help encourage this transition, “said Alan Hsu, Corporate Vice President & General Manager, smart connectivity in MediaTek.
“Every solution has a very integrated design that packs the latest on-chip processing and power management technology into ultra-small designs is not greater than the size of the thumbnail.”