The government offers up to 50% of project costs to companies that make up the chip factory – News2IN
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The government offers up to 50% of project costs to companies that make up the chip factory

The government offers up to 50% of project costs to companies that make up the chip factory
Written by news2in

Bengaluru: Following the announcement of the 76,000 Crore RS incentive scheme for semiconductors, the government has issued detailed guidelines around it.
The government will provide up to 50 percent of the project costs to producers who want to build facilities to make chips up to 28nm (nanometers), up to 40 percent of the chip costs above 28nm and up to 45nm, and up to 45nm, and up to 45nm, and up to 30 percent Chip above 45nm and up to 65nm.
Nm is a millionth of one meter and, in semiconductor, represents the least distance between the transistor in a chip.
Chips are getting smaller and better because the researchers find ways to reduce the distance between the transistor.
“Support under the scheme must be provided for six years.
The actual ownership of fiscal fiscal currents can be extended based on electronic approval and IT ministers,” said the document.
In terms of fiscal support provided as equity, the government department will not exceed 49 percent of the total project equity.
This scheme will be implemented through nodal agents called Indian semiconductor missions.
Applicants must make a minimum capital investment of Rs 20,000 Crore.
And applicants must have a minimum income of Rs 7,500 Crore (including group companies) in the design and manufacturing of electronic systems in one of the three years of finance before the year of submission.
The document said that domestic electronic manufacturing has increased substantially over the past few years and continues to move from the semi-knock (SKD) stage to the manufacturing stage which is fully torn down (CKD).
“However, the addition of domestic values ​​is estimated to be in the range of 10 percent – 30 percent, and manufacturing growth so far mainly because the final assembly uses import components, sub-assemblies / parts, etc.
This is due to a lack of strong semiconductor manufacturing ecosystems in this country, “He said.

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