Apple iPhone 13 Pro has recently been dismantled in an investigation step with IFIXIT Teardown specialist to conclude some relevant information about the phone that might not be questioned by Apple.
After teardown, Ifixit said that they found some hidden details.
This is what they claims have been found under the surface, literally.
According to the report, there are new facial ID arrays on an iPhone that combines the flood iluminator and dot protector into a single unit and has helped make a smaller notch on the new iPhone.
In accordance with tear claims, the notch on the iPhone 13 Pro is around 20% smaller than that at 12 pro because of the merging of flood iluminators and dot projectors into one unit.
Also, the earpiece speaker has shifted from the front notch to the top bezel.
Next, they have mentioned that the Dot projector in Selfie Shooter has “moved from the edge to the center of the module this year.” They added that the replacement of the display will “knock down” facarid.
“Face ID works even when we disconnect the front sensor assembly.
However, any screen is replaced to knock down the face id.
We try to transfer sensors from the old screen and porting through the hardware id face, but no dice.
It looks like the screen is locked serially to the phone .
“With teardown, they also claim that Apple might have put an OLED panel integrated new touch this year on the iPhone 13 Pro.
The integrated OLED panel reduces the costs and materials involved by combining touch and OLED layers on the screen.
Coming to the logic board, Teardown revealed that the logic board was layered “even teenagers” this year, and the SIM card reader is now “baked to the board”.
He claimed that the following chip was on board: “Apple All1W07 AL15 Bionic SOC layered with what is most likely 6GB SK Hynix LPDDR4X SDRAM, Apple / USI U1 ULTRA-WIDEBAND CHIP, Apple All1098 Power Management IC, SkyWorks SKY58276-17 Module Front- End, SkyWorks SKY58271-19 Module Front-End, Apple 338S00770-B0 Power Management IC and STB601A05 Power Management IC Management IC.
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